TFUER-T301
* Solder Pallet Materials (Equivalent to Durostone)
T301 is an advanced, high-performance thermoset composite, precision-engineered for the rigorous demands of the electronics assembly industry. With its exceptional thermal stability and mechanical integrity, it serves as the premier substrate for wave solder pallets, SMT carriers, and critical heat-shielding components.
Thickness: 3 mm ~ 50 mm.
Dimension: 1020 x 1220 mm, 1220 x 2440 mm.
Color: Black, Grey.
TFUER-T315
* Solder Pallet Materials (Equivalent to Ricocel)
T315 is a premier, industrial-grade composite engineered specifically for SMT and wave/reflow solder pallet fabrication. Composed of high-density glass fiber fabric impregnated with an advanced thermoset epoxy resin, T315 delivers an optimal balance of structural rigidity, long-term thermal endurance, and exceptional resistance to corrosive soldering fluxes.
Thickness: 3 mm ~ 50 mm.
Dimension: 1020 x 1220 mm, 1220 x 2440 mm.
Color: Black.